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HMC454ST89_07 Datasheet, PDF (10/12 Pages) Hittite Microwave Corporation – InGaP HBT ½ WATT HIGH IP3 AMPLIFIER, 0.4 - 2.5 GHz
v04.0907
1960 & 2140 MHz Evaluation PCB
HMC454ST89 / 454ST89E
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
List of Materials for Evaluation PCB 107749 [1]
Item
J1 - J2
J3 - J4
C1
C2
C3
C4
C5
L1
U1
Description
PCB Mount SMA Connector
DC Pins
1.0 pF Capacitor, 0402 Pkg.
1.2 pF Capacitor, 0402 Pkg.
3.0 pF Capacitor, 0402 Pkg.
100 pF Capacitor, 0402 Pkg.
2.2 μF Capacitor, Tantalum
8.2 nH Inductor, 0402 Pkg.
HMC454ST89 / HMC454ST89E
The circuit board used in this application should use
RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads and exposed paddle should be connected
directly to the ground plane similar to that shown.
A sufficient number of via holes should be used to
connect the top and bottom ground planes. The
evaluation board should be mounted to an appro-
priate heat sink. The evaluation circuit board shown
is available from Hittite upon request.
PCB [2]
107747 Evaluation PCB, 10 mils
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350, Er = 3.48
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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