FH34S-6S-0.5SH50 Datasheet, PDF (8/12 Pages) Hirose Electric – 0.5 mm Pitch, 1.0 mm above the board Top and Bottom Contact, Back-Flip actuator Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors

FH34(S)Seriesq0.5 mm Pitch, 1.0 mm above the board Top and Bottom Contact, Back-Flip actuator Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
sTemperature Profile
MAX 250ç ^{HRS test condition}
Solder method
: Reflow, IR/hot air
250
Environment
: Room air
230ç
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
200
200ç
(Senju Metal Industry, Co., Ltd.'s Part Number:
M705-221CM5-42-10.5)
Test board
: Glass epoxy 25mm∞40mm∞0.8mm thick
150
150ç
Land dimensions : 0.3mm∞0.8mm
Metal mask
: 0.25∞0.65∞0.1mm thick
100
50
25ç _{(60 sec.) 90 to 120 sec.}
0
Preheating
Start
(60 sec.)
Soldering
Time (Seconds)
The temperature profiles shown are based on the above conditions.
In individual applications the actual temperature may vary, depending
on solder paste type, volume / thickness and board size / thickness.
Consult your solder paste and equipment manufacturer for specific
recommendations.
8