W-FL2 Datasheet, PDF (6/6 Pages) Hirose Electric – Ultra-Small Surface Mount Coaxial Connectors - 1.18mm Mated Height

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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sPrecautions
1. Plugs
(1) Mating / unmating
q To disconnect connectors, insert the extraction side of insertion and extraction jig W.FL2-LP-IN.OUT and perform as
described in the diagram below.
• Unmating
*OTFSU
UIF
FYUSBDUJPO
TJEF
PG
UIF
8'-
5JMU
UIF
UPPM
BT
TIPXO

q -1*/
UPPM
VOEFS
UIF
NBUFE
QMVH
BU
UIF
w BOE
MJGU
UIF
QMVH
DBCMF

DBCMF
DPOOFDUJPO
TJEF
BT
TIPXO 
BTTFNCMZ
3FNPWBM

DPNQMFUF
qUse of the extraction tool is absolutely
mandatory. Any attempt of unmating by
pulling on the cable may result in damage
and affect the mechanical / electrical
performance.
• Mating
q Align the mating tool W.FL-LP-IN or the
mating end of the tool W.FL2-LP-IN.OUT over
the plug end of the cable assembly.
w Firmly place the tool over the plug until it is
secured in the tool.
e Place the plug cable assembly (held in the
tool) over the corresponding receptacle.
r Assuring that the plug and receptacle are
aligned press-down perpendicular to the
mounting surface until both connectors are
fully mated.
t Remove the mating tool by carefully pulling it
up.Removal of the tool
q
w
W.FL2-LP-040 (Plug)
8
'-
1MVH
QJDLVQ
e
r
t
W. FL2-R-SMT-1:
*OTFSUJPO
UP
B
8
'-
SFDFQUBDMF
3FNPWBM
PG

UIF
UPPM
(2) Pull forces on the
cable after connectors
are mated
• Plug
Do NOT apply any pull forces after the
bending of the cable.
W.FL2-LP-040
2 N max.
W.FL2-R-SMT-1
(3) Precautions
2. Receptacles
(1) Recommended reflow
temperature profile
Do not twist connectors excessively during mating / unmating.
250 ç max. for
[ç]
10 seconds
260
240
220
200
180
Preheat
(130 to 180ç)
230ç
220ç
q The temperature of the printed circuit board surface
temperature at the points of contact with the terminals.
w Reflow soldering should be performed at a printed
circuit surface temperature of 250°C max.
160
140
120
100
120 seconds max.
80
50 seconds max.
60 seconds max.
e In individual applications the actual temperature may
vary, depending on the solder paste type, volume /
thickness and board size / thickness. Consuly your
solder paste and equipment manufacturer for specific
recommendations.
Time
(2) Recommended metal mask thickness 0.1 mm to 0.12 mm
(3) Reflow cycles
2 times
3. Operating environment and storage conditions
(1) Operating environment
The connectors are NOT designed to operate in the following environments:
• Exposed to a excessive amounts of fine particles and dust
• Regions and places having a high density of sulfur dioxide, hydrogen sulfide, nitrogen dioxide or other corrosive gasses.
• Environments having large rapid variations in temperature.
(2) Storage conditions -
Receptacle
Store in the Hirose Electric packaging.
Temperature: -10 to +40ç, Humidity: 85% max.
Use within 6 months of delivery.
Receptacles for which the storage period has elapsed must be tested for solderability to the PC board mounting surface.
®
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: [phone], FAX: [phone]
http://www.hirose.com
http://www.hirose-connectors.com
The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.
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