C4650 Datasheet, PDF (11/11 Pages) Hirose Electric – Interface Connectors for Miniature, Portable Terminal Devices

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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BRecommended Temperature Profile (Lead-free soldering compound)
(ç)
250
200 _180ç
150 ^150ç
100
50
240ç
230ç min
60S
30S
HRS test conditions
Solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu
Test board: Glass epoxy 35mm∞35mm∞0.8mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
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