105XG2D Datasheet, PDF (4/6 Pages) HB Electronic Components – High bright output

Hebei I.T. (Shanghai) Co., Ltd.
Ø Lead Forming/成形
LED SPECIFICATION
Part No.：105XG2D
1. Any lead forming or bending must be done before soldering.
支架成形必须在焊接前完成。
2. When forming leads, there must be a minimum of 2mm clearance between the base of the LED lens and
the lead bend.
必需离胶体 2 毫米才能折弯支架。
3. Avoid bending the leads at the same point more than once.
避免在管脚同一位置两次或多次弯。
4. During assembly onto PCB, the lead pitch of the LED must match the pitch of the mounting holes on
the PCB during component placement.
支架成形需保证引脚和间距与线路板上一致。
Ø Soldering Condition/焊接条件
Careful attention should be paid during soldering. When soldering, leave more then 2mm from solder joint
to case, and soldering beyond the base of the tie bar is recommended.
焊接时请特别注意，焊接点要离LED封装体底部2mm以上。
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when
soldering.
在 LED 处于高温，特别是在焊接时，请避免对支架施压。
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