RFD3055 Datasheet, PDF (8/8 Pages) Intersil Corporation – 12A, 60V, 0.150 Ohm, N-Channel Power MOSFETs

RFD3055, RFD3055SM, RFP3055
Packaging (Continued)
E
H₁
b₂
D
L₁
1
b
3
e
e₁
TERM. 4
L2
b₁
A
A₁
SEATING
PLANE
L
L₃
c
J₁
0.265
(6.7)
L₄
b₃
0.265 (6.7)
BACK VIEW
0.070 (1.8)
0.118 (3.0)
0.063 (1.6)
0.063 (1.6)
0.090 (2.3)
0.090 (2.3)
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
TO-252AA
2 LEAD JEDEC TO-252AA PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.086
0.094
2.19
2.38
-
A₁
0.018
0.022
0.46
0.55
4, 5
b
0.028
0.032
0.72
0.81
4, 5
b₁
0.033
0.040
0.84
1.01
4
b₂
0.205
0.215
5.21
5.46
4, 5
b₃
0.190
-
4.83
-
2
c
0.018
0.022
0.46
0.55
4, 5
D
0.270
0.290
6.86
7.36
-
E
0.250
0.265
6.35
6.73
-
e
0.090 TYP
2.28 TYP
7
e₁
0.180 BSC
4.57 BSC
7
H₁
0.035
0.045
0.89
1.14
-
J₁
0.040
0.045
1.02
1.14
-
L
0.100
0.115
2.54
2.92
-
L₁
0.075
0.090
1.91
2.28
3
L₂
0.025
0.040
0.64
1.01
-
L₃
0.020
-
0.51
-
4, 6
L₄
0.170
-
4.32
-
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. B of
JEDEC TO-252AA outline dated 9-88.
2. L₄ and b₃ dimensions establish a minimum mounting surface for
terminal 4.
3. Solder finish uncontrolled.
4. Dimension (without solder).
5. Add typically 0.0006 inches (0.015mm) for solder coating.
6. L₃ is the terminal length for soldering.
7. Position of lead to be measured 0.090 inches (2.28mm) from bottom
of dimension D.
8. Controlling dimension: Inch.
9. Revision 2 dated 6-93.
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