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HSD32M64F8R Datasheet, PDF (6/30 Pages) Hanbit Electronics Co.,Ltd – Synchronous DRAM Module 256Mbyte (32Mx64bit), SMM ,16Mx16, 4Banks, 8K Ref. 3.3V
HANBit
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)
TEST
PARAMETER
SYMBOL
CONDITION
-13
Operating current
(One bank active)
Precharge standby
current in power-down
mode
Precharge standby
Burst length = 1
ICC1
tRC ≥ tRC(min)
960
IO = 0mA
ICC2P
CKE ≤ VIL(max)
tCC=10ns
ICC2PS
CKE & CLK ≤ VIL(max)
tCC=∞
ICC2N
CKE ≥ VIH(min)
/CE ≥ VIH(min), tcc=10ns
Input signals are changed one
current in non power-
time during 20ns
down mode
ICC2NS
CKE ≥ VIH(min)
CLK ≤ VIL(max), tcc=∞
Input signals are stable
Active standby current in
power-down mode
ICC3P
ICC3PS
CKE ≤ VIL(max), tcc=10ns
CKE&CLK ≤ VIL(max)
tcc=∞
Active standby current in
ICC3N
CKE≥VIH(min),
/CE≥VIH(min), tcc=10ns
Input signals are changed one
non power-down mode
time during 20ns
(One bank active)
CKE≥VIH(min)
ICC3NS
CLK ≤VIL(max), tcc=∞
Input signals are stable
Operating current
ICC4
(Burst mode)
IO = 0 mA
Page burst
1.2
4Banks Activated
tCCD = 2CLKs
Refresh current
ICC5
tRC ≥ tRC(min)
Self refresh current
ICC6
Notes:
CKE ≤ 0.2V
1. Measured with outputs open.
2. Refresh period is 64ms.
3. Measured with 1PLL & 3 Drive Ics.
4. Unless otherwise noticed, input swing level is CMOS(VIH/VIL=VDDQ/VSSQ).
1.76
HSD32M64F8R
VERSION
-10L
-10
NOT
UNIT
E
880
880
mA
1
8
mA
3
8
mA
3
160
mA
3
56
40
mA
3
40
240
mA
3
160
1
1
A
1
1.68
1.68
A
2
12
mA
3
URL:www.hbe.co.kr
REV.1.0(August.2002).
-6-
HANBit Electronics Co.,Ltd