S11105_15 Datasheet, PDF (8/9 Pages) Hamamatsu Corporation – CMOS linear image sensors

CMOS linear image sensors
S11105 series
Pin connections
Pin no.
1
2
3
4
5
6
7
8
9
10
11
Symbol
NC
ST
CLK
Vss
Vdd
NC
Trig
Vdd
Video
EOS
Vss
S11105
I/O
Description
Pin no.
No connection
12
I Start pulse
13
I Clock pulse
14
GND
15
I Supply voltage
16
No connection
17
O
Trigger pulse for video signal
acquisition
18
I Supply voltage
19
O Video signal
20
O End of scan
21
GND
22
Symbol
NC
NC
NC
NC
NC
NC
NC
NC
NC
Vdd
NC
I/O
Description
No connection
No connection
No connection
No connection
No connection
No connection
No connection
No connection
No connection
I Supply voltage
No connection
Pin no.
1
2
3
4
5
6
7
8
Symbol
Vss
Vdd
Vss
NC
NC
NC
Trig
Vdd
S11105-01
I/O
Description
Pin no.
GND
9
I Supply voltage
10
GND
11
No connection
12
No connection
13
No connection
14
O
Trigger pulse for video signal
acquisition
15
I Supply voltage
16
Symbol
Video
EOS
Vss
NC
NC
Vdd
ST
CLK
I/O
Description
O Video signal
O End of scan
GND
No connection
No connection
I Supply voltage
I Start pulse
I Clock pulse
Precautions
(1) Electrostatic countermeasures
This device has a built-in protection circuit against static electrical charges. However, to prevent destroying the device with electro-
static charges, take countermeasures such as grounding yourself, the workbench and tools to prevent static discharges. Also protect
this device from surge voltages which might be caused by peripheral equipment.
(2) Light input window
If the incident window is contaminated or scratched, the output uniformity will deteriorate considerably, so care should be taken in
handling the window. Avoid touching it with bare hands.
The window surface should be cleaned before using the device. If dry cloth or dry cotton swab is used to rub the window surface,
static electricity may be generated, and therefore this practice should be avoided. Use soft cloth, cotton swab or soft paper moist-
ened with ethyl alcohol to wipe off dirt and foreign matter on the window surface.
(3) Soldering
To prevent damaging the device during soldering, take precautions to prevent excessive soldering temperatures and times. Solder-
ing should be performed within 5 seconds at a soldering temperature below 260 °C.
(4) Reflow soldering (S11105-01)
Soldering conditions may differ depending on the board size, reflow furnace, etc. Check the conditions before soldering. A sudden
temperature rise and cooling may be the cause of trouble, so make sure that the temperature change is within 4 °C per second.
The bonding portion between the ceramic base and the glass may discolor after reflow soldering, but this has no adverse effects on
the hermetic sealing of the product.
(5) Operating and storage environments
Handle the device within the temperature range specified in the absolute maximum ratings. Operating or storing the device at an
excessively high temperature and humidity may cause variations in performance characteristics and must be avoided.
(6) UV exposure
This product is not designed to prevent deterioration of characteristics caused by UV exposure, so do not expose it to UV
light.
8