G12460-0606S_15 Datasheet, PDF (8/9 Pages) Hamamatsu Corporation – Image sensor with 64 x 64 pixels developed for two-dimensional infrared imaging

InGaAs area image sensor
G12460-0606S
Pin connections
Pin no.
Name
Input/Output
Function
1
Vss
Input
0 V ground
2
Vdd
Input
+5 V supply voltage
3
MCLK
Input
Clock pulse for timing generator
4
AD_TRIG
Output
Signal for A/D sampling
5
MSP
Input
Clock pulse for flame scan start
6
NC
-
-
7
NC
-
-
8
Vdd
Input
+5 V supply voltage
9
PD_bias
Input
Photodiode bias voltage
10
Vb1
Output
Pixel bias voltage
11
NC
-
-
12
VIDEO
Output
Video output
13
TE (-)
Input
TE-cooler (-)
14
THERM
Output
Thermistor
15
THERM
Output
Thermistor
16
TE (+)
Input
TE-cooler (+)
* Do not connect anything to the NC terminals.
Note: Connect a bypass capacitor of 0.1 μF to the Vb1 terminal.
Remark
0V
5V
Falling synchronous pulse
Falling synchronous pulse
5V
4.5 V
1.27 V
1.2 to 3.2 V
Precautions
(1) Electrostatic countermeasures
This device has a built-in protection circuit against static electrical charges. However, to prevent destroying the device with electrostatic
charges, take countermeasures such as grounding yourself, the workbench and tools to prevent static discharges. Also protect this de-
vice from surge voltages which might be caused by peripheral equipment.
(2) Incident window
If dust or dirt gets on the light incident window, it will show up as black blemishes on the image. When cleaning, avoid rubbing the
window surface with dry cloth or dry cotton swab, since doing so may generate static electricity. Use soft cloth, paper or a cotton swab
moistened with alcohol to wipe dust and dirt off the window surface. Then blow compressed air onto the window surface so that no
spot or stain remains.
(3) Soldering
To prevent damaging the device during soldering, take precautions to prevent excessive soldering temperatures and times. Soldering
should be performed within 5 seconds at a soldering temperature below 260 °C.
(4) Operating and storage environments
Handle the device within the temperature range specified in the absolute maximum ratings. Operating or storing the device at an exces-
sively high temperature and humidity may cause variations in performance characteristics and must be avoided.
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