L11854-307-05_15 Datasheet, PDF (2/2 Pages) Hamamatsu Corporation – 3 Stack Pulsed Laser Diode

3 Stack Pulsed Laser Diode L11854-307-05
Figure 1: Radiant output power vs. Forward current (typ.)
(Top(c) = 25 ℃)
35
30
25
20
15
10
5
0
0
2
4
6
8
10
12
Forward current Ifp (A)
Figure 2: Typical emission spectrum
100
(Ifp = 7 A, Top(c) = 25 ℃)
80
60
40
20
0
885
895
905
915
925
Wavelength (nm)
Figure 3: Directivity (typ.)
100
(Ifp = 7 A, Top(c) = 25 ℃)
80
Parallel θ//
Figure 4: Dimensional outline (unit: mm)
5.6
+0.01
- 0.05
4.4 MAX.
3.55±0.2
Glass window
1.0 MIN.
60
Vertical θ⊥
40
0.45±0.05
20
Lead
2.0±0.2
0
-40 -30 -20 -10 0
10 20 30 40
0.4
LD
Angle (degree)
Handling Precautions for L11854-307-05
1. Precautions for handling
The LD (laser diode) may be damaged or its performance may deteriorate
due to such factors as electrostatic discharge from the human body, surge
voltages from measurement equipment, leakage voltages from soldering
irons, and packing materials. As a countermeasure against static electricity,
the device, operator, work place and measuring jigs must all be set at the
same electric potential. In using LD, observe the following precautions:
∑To protect the device from static electricity charges which accumulate on
the operator or the operator's clothes, use a wrist strap etc. to ground the
operator's body via a high impedance resistor (1 MΩ).
∑A semiconductive sheet should be laid on both the work table and the
floor in the work area. When soldering, use an electrically grounded
soldering iron with an isolation resistance of more than 10 MΩ.
∑For containers for transportation and packing, use of antistatic material
(material that minimizes the generation of static change when rubbed
against or separated from itself or other similar materials).
2. Precautions for mounting
(1)Lead forming
To form the leads, hold the base of the leads securely and bend them so
that no force is applied to the package. Lead forming should be done
before soldering.
(2)Cutting off the leads
If leads are out when still at a high temperature, this may cause an
electrical discontinuity. Always cut off the leads when they are at room
temperature. Never cut off the leads immediately after they are soldered.
N.C. (no connection)
1.0
LD cathode
LD anode
(Case)
Handling Precautions for L11854-307-05
1. Precautions for handling
The LD (laser diode) may be damaged or its performance may deterio-
rate due to such factors as electrostatic discharge from the human body,
surge voltages from measurement equipment, leakage voltages from
soldering irons, and packing materials. As a countermeasure against
static electricity, the device, operator, work place and measuring jigs
must all be set at the same electric potential. In using LD, observe the
following precautions:
∑To protect the device from static electricity charges which accumulate
on the operator or the operator's clothes, use a wrist strap etc. to ground
the operator's body via a high impedance resistor (1 MΩ).
∑A semiconductive sheet should be laid on both the work table and the
floor in the work area. When soldering, use an electrically grounded
soldering iron with an isolation resistance of more than 10 MΩ.
∑For containers for transportation and packing, use of antistatic material
(material that minimizes the generation of static change when rubbed
against or separated from itself or other similar materials).
2. Precautions for mounting
(1)Lead forming
To form the leads, hold the base of the leads securely and bend them so
that no force is applied to the package. Lead forming should be done
before soldering.
(2)Cutting off the leads
If leads are out when still at a high temperature, this may cause an
electrical discontinuity. Always cut off the leads when they are at room
temperature. Never cut off the leads immediately after they are soldered.
HAMAMATSU PHOTONICS K.K. ^{www.hamamatsu.com}
HAMAMATSU PHOTONICS K.K., Laser Group, Laser Business Promotion Group
1-8-3, Shinmiyakoda, Kita-ku, Hamamatsu City, Shizuoka, 431-2103, Japan, Telephone: [phone], Fax: [phone], E-mail: [e-mail]
U.S.A.: Hamamatsu Corporation:360 Foothill Road, Bridgewater, N.J. 08807-0910, U.S.A.Telephone: [phone], Fax: [phone] E-mail: [e-mail]
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: [phone], Fax: [phone], E-mail: [e-mail]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: [phone], Fax: [phone], E-mail: [e-mail]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: [phone], Fax: [phone], E-mail: [e-mail]
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 SE-164 40 Kista, Sweden, Telephone: [phone], Fax: [phone], E-mail: [e-mail]
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese, (Milano), Italy, Telephone: [phone], Fax: [phone], E-mail: [e-mail]
Cat. No. LPLD2017E03
China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: [phone], Fax: [phone], E-mail: [e-mail] JUN. 2015 HPK