C9732DK-11 Datasheet, PDF (1/9 Pages) Hamamatsu Corporation – For soft X-ray imaging, cassette type with USB 2.0 interface Large photodiode area: 120 × 120 mm

Flat panel sensor
C9732DK-11
For soft X-ray imaging, cassette type with USB 2.0 interface
Large photodiode area: 120 × 120 mm
The C9732DK-11 is two-dimensional CMOS image sensor module designed for X-ray imaging which requires high resolution,
large area and wide dynamic range. A target material of X-ray source and X-ray energy adequate for the sensor is Mo and 17
keV. The device shape is thin cassette which incorporate on-chip high-resolution scintillator and a control board. An on-board
USB 2.0 interface can realize fast data transfer with the C9732DK-11.
Features
2400 × 2400 pixels (50 μm pitch)
High resolution
14-bit digital output (USB 2.0 interface)
High-speed imaging: 1 frame/s
No dead area (insensitive area) due to seamless structure
Compatible with Hamamatsu API (DCAM-API)
Applications
X-ray imaging (optimized to 17 keV)
Structure
The C9732DK-11 is comprised of a sensor board and a control board. Mounted on the sensor board is a CMOS image sensor chip made up of a
two-dimensional photodiode array, row-scanning vertical shift register, and 8 charge amplifier arrays. Each charge amplifier array has a horizontal
shift register and consists of 300 ch charge amplifiers with CDS circuit.
CsI scintillator is directly deposited on the two-dimensional photodiode array. X-rays incident on the scintillator are converted to fluorescence,
which then enters the two-dimensional photodiode array where electric charge is accumulated in each pixel according to the light intensity. The
accumulated charge on each row is sequentially selected by the row-scanning vertical shift register, transferred to the amplifiers through the data
line, and converted to a voltage signal. Then an analog signal is sent out from each amplifier array by scanning the horizontal shift register.
The control board converts the analog signal into a 14-bit digital signal, which is then output to a PC through the USB 2.0 interface.
Pixel number
12
Sensor board
2399 2400
2401
4799 4800
External power supply
A.vdd, D.vdd (not attached)
Photodiode
array
with directly
deposited CsI
scintillator
Charge amp array
No. 1
(with horizontal shift
register, 300 ch)
5759999 5760000
Charge amp array
No. 8
(with horizontal shift
register, 300 ch)
Buffer
amp
Buffer
amp
Timing
pulse
generator
Bias
generator
Processing
amp
Processing
amp
Oscillator
A/D FIFO
A/D FIFO
Control board
Note: Signals are read out in order of pixel number.
USB IC
TrgIn
TrgOut
Video data
Flat panel control
(USB 2.0 interface)
KACCC031
KACCC0310EC
www.hamamatsu.com
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