GS8161E18BT-V Datasheet, PDF(32/35 Page) GSI Technology – 1M x 18, 512K x 36, 512K x 36 18Mb Sync Burst SRAMs

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GS8161E18BT-V Datasheet, PDF (32/35 Pages) GSI Technology – 1M x 18, 512K x 36, 512K x 36 18Mb Sync Burst SRAMs

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Preliminary

GS8161ExxB(T/D)-xxxV

Ordering Information for GSI Synchronous Burst RAMs

Org

Part Number1

Type

Voltage

Option

Package

Speed2

(MHz/ns)

TA3 Status4

1M x 18 GS8161E18BT-250V

DCD

1.8 V or 2.5 V

TQFP

250/5.5

C

MP

1M x 18 GS8161E18BT-200V

DCD

1.8 V or 2.5 V

TQFP

200/6.5

C

MP

1M x 18 GS8161E18BT-150V

DCD

1.8 V or 2.5 V

TQFP

150/7.5

C

MP

512K x 36 GS8161E36BT-250V

DCD

1.8 V or 2.5 V

TQFP

250/5.5

C

MP

512K x 36 GS8161E36BT-200V

DCD

1.8 V or 2.5 V

TQFP

200/6.5

C

MP

512K x 36 GS8161E36BT-150V

DCD

1.8 V or 2.5 V

TQFP

150/7.5

C

MP

1M x 18 GS8161E18BT-250IV

DCD

1.8 V or 2.5 V

TQFP

250/5.5

I

MP

1M x 18 GS8161E18BT-200IV

DCD

1.8 V or 2.5 V

TQFP

200/6.5

I

MP

1M x 18 GS8161E18BT-150IV

DCD

1.8 V or 2.5 V

TQFP

150/7.5

I

MP

512K x 36 GS8161E36BT-250IV

DCD

1.8 V or 2.5 V

TQFP

250/5.5

I

MP

512K x 36 GS8161E36BT-200IV

DCD

1.8 V or 2.5 V

TQFP

200/6.5

I

MP

512K x 36 GS8161E36BT-150IV

DCD

1.8 V or 2.5 V

TQFP

150/7.5

I

MP

1M x 18 GS8161E18BD-250V

DCD

1.8 V or 2.5 V

165 BGA

250/5.5

C

MP

1M x 18 GS8161E18BD-200V

DCD

1.8 V or 2.5 V

165 BGA

200/6.5

C

MP

1M x 18 GS8161E18BD-150V

DCD

1.8 V or 2.5 V

165 BGA

150/7.5

C

MP

512K x 32 GS8161E32BD-250V

DCD

1.8 V or 2.5 V

165 BGA

250/5.5

C

MP

512K x 32 GS8161E32BD-200V

DCD

1.8 V or 2.5 V

165 BGA

200/6.5

C

MP

512K x 32 GS8161E32BD-150V

DCD

1.8 V or 2.5 V

165 BGA

150/7.5

C

MP

512K x 36 GS8161E36BD-250V

DCD

1.8 V or 2.5 V

165 BGA

250/5.5

C

MP

512K x 36 GS8161E36BD-200V

DCD

1.8 V or 2.5 V

165 BGA

200/6.5

C

MP

512K x 36 GS8161E36BD-150V

DCD

1.8 V or 2.5 V

165 BGA

150/7.5

C

MP

1M x 18 GS8161E18BD-250IV

DCD

1.8 V or 2.5 V

165 BGA

250/5.5

I

MP

1M x 18 GS8161E18BD-200IV

DCD

1.8 V or 2.5 V

165 BGA

200/6.5

I

MP

1M x 18 GS8161E18BD-150IV

DCD

1.8 V or 2.5 V

165 BGA

150/7.5

I

MP

512K x 32 GS8161E32BD-250IV

DCD

1.8 V or 2.5 V

165 BGA

250/5.5

I

MP

512K x 32 GS8161E32BD-200IV

DCD

1.8 V or 2.5 V

165 BGA

200/6.5

I

MP

512K x 32 GS8161E32BD-150IV

DCD

1.8 V or 2.5 V

165 BGA

150/7.5

I

MP

512K x 36 GS8161E36BD-250IV

DCD

1.8 V or 2.5 V

165 BGA

250/5.5

I

MP

512K x 36 GS8161E36BD-200IV

DCD

1.8 V or 2.5 V

165 BGA

200/6.5

I

MP

512K x 36 GS8161E36BD-150IV

DCD

1.8 V or 2.5 V

165 BGA

150/7.5

I

MP

Notes:

1. Customers requiring delivery in Tape and Reel should add the character âTâ to the end of the part number. Example: GS8161E18BT-150IVT.

2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each

device is Pipeline/Flow Through mode-selectable by the user.

3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.

4. MP = Mass Production. PQ = Pre-Qualification.

5. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are

covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.

Rev: 1.01a 6/2006

32/35

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Â© 2004, GSI Technology

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