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| GS81313LD36GK-714I Datasheet, PDF (26/26 Pages) GSI Technology – 4Mb x 36 and 8Mb x 18 organizations available | |||
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Revision History
Rev. Code
GS81313LD1836GK_r1.05
GS81313LD1836GK_r1.06
GS81313LD1836GK_r1.07
GS81313LD1836GK_r1.08
GS81313LD1836GK_r1.09
GS81313LD1836GK_r1.10
GS81313LD1836GK_r1.11
GS81313LD1836GK_r1.12
GS81313LD1836GK_r1.13
GS81313LD18/36GK-833/714/625
Types of Changes
Format or Content
â
Content
Content
Content
Content
Content
Content
Content
Content
Revisions
⢠Initial public release.
⢠Removed leaded BGA package support.
⢠Miscellaneous cleanup.
⢠Increased VDD (max) to 1.35V.
⢠Added package thermal impedances.
⢠Added tKHKH (max) specs.
⢠Revised tKHKDH specs.
⢠Revised tKHQV, tKHQX, and tKHCQH specs.
⢠Revised tCQHQV and tCQHQX specs.
⢠Banner changed to âPreliminaryâ, to reflect ES status.
⢠Updated speed bins to -833, -714, and -625.
⢠Added input pulse width specs.
⢠Added IDD specifications.
⢠Removed âPreliminaryâ from data sheets.
⢠Increased VDD (min) to 1.2V for 625 MHz speed bin. VDD (min) is
now the same value for all speed bins.
⢠A 2Kï resistor connected between RCS and VSS is now required;
previously, it was optional.
Rev: 1.13 7/2016
26/26
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2014, GSI Technology
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