GS81302D08GE-300 Datasheet, PDF (20/34 Pages) GSI Technology – 144Mb SigmaQuadTM-II Burst of 4 SRAM

GS81302D08/09/18/36E-375/350/333/300/250
AC Electrical Characteristics (Continued)
Parameter
-375
-350
Symbol
Min Max Min Max
-333
Min Max
-300
Min Max
-250
Units Notes
Min Max
Hold Times
Address Input Hold Time
t_KHAX
0.4
—
0.4
—
0.4
—
0.4
—
0.5
—
ns
1
Control Input Hold Time (R, W)
t_KHIX
0.4
—
0.4
—
0.4
—
0.4
—
0.5
—
ns
2
Control Input Hold Time (BWX), (BWX)
t_KHIX
0.28 — 0.28 —
0.28
—
0.3
— 0.35 —
ns
3
Data Input Hold Time
t_KHDX
0.28 — 0.28 —
0.28
—
0.3
— 0.35 —
ns
Notes:
1. All Address inputs must meet the specified setup and hold times for all latching clock edges.
2. Control signals are R, W
3. Control signals are BW0, BW1, and (NW0, NW1 for x8) and (BW2, BW3 for x36).
4. If C, C are tied high, K, K become the references for C, C timing parameters
5. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus contention because tCHQX1 is a MIN
parameter that is worst case at totally different test conditions (0°C, 1.9 V) than tCHQZ, which is a MAX parameter (worst case at 70°C, 1.7 V). It is not possible for two
SRAMs on the same board to be at such different voltages and temperatures.
6. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
7. V_DD slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once V_DD and input clock are stable.
8. Echo clock is very tightly controlled to data valid/data hold. By design, there is a ±0.1 ns variation from echo clock to data. The datasheet parameters reflect tester guard
bands and test setup variations.
Rev: 1.04c 8/2017
20/34
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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