GS8320Z36AGT-200I Datasheet, PDF (14/24 Pages) GSI Technology – 36Mb Pipelined and Flow Through Synchronous NBT SRAMs

GS8320Z18/36AGT-400/375/333/250/200/150
V_DD2 Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Input High Voltage
V_IH
0.6*V_DD
—
V_DD + 0.3
V
Input Low Voltage
V_IL
–0.3
—
0.3*V_DD
V
Notes:
1. V_IH (max) must be met for any instantaneous value of V_DD.
2. V_DD needs to power-up before or at the same time as V_DDQ to make sure V_IH (max) is not exceeded.
Operating Temperature
Parameter
Symbol
Min.
Typ.
Max.
Unit
Junction Temperature
(Commercial Range Versions)
T_J
0
25
85
C
Junction Temperature
(Industrial Range Versions)*
T_J
–40
25
100
C
Note:
* The part numbers of Industrial Temperature Range versions end with the character “I”. Unless otherwise noted, all performance specifications
quoted are evaluated for worst case in the temperature range marked on the device.
Thermal Impedance
Package
Test PCB
Substrate
JA (C°/W)
Airflow = 0 m/s
 JA (C°/W)
Airflow = 1 m/s
 JA (C°/W)
Airflow = 2 m/s
JB (C°/W)  JC (C°/W)
100 TQFP
4-layer
28.7
23.8
22.3
15.1
6.5
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
Undershoot Measurement and Timing
Overshoot Measurement and Timing
V_IH
20% tKC
V_DD + 2.0 V
V_SS
50%
50%
V_DD
V_SS – 2.0 V
20% tKC
V_IL
Note:
Input Under/overshoot voltage must be –2 V > Vi < V_DDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 1.03 8/2013
14/23
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology