GS816036DGT-150I Datasheet, PDF (1/25 Pages) GSI Technology – 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs

GS816018/32/36DGT-400/375/333/250/200/150
100-Pin TQFP
Commercial Temp
Industrial Temp
1M x 18, 512K x 32, 512K x 36
18Mb Sync Burst SRAMs
400 MHz–150 MHz
2.5 V or 3.3 V V_DD
2.5 V or 3.3 V I/O
Features
• FT pin for user-configurable flow through or pipeline
operation
• Single Cycle Deselect (SCD) operation
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• RoHS-compliant 100-lead TQFP package available
Functional Description
Applications
The GS816018/32/36DGT is an 18,874,368-bit high
performance synchronous SRAM with a 2-bit burst address
counter. Although of a type originally developed for Level 2
Cache applications supporting high performance CPUs, the
device now finds application in synchronous SRAM
applications, ranging from DSP main store to networking chip
set support.
Controls
Addresses, data I/Os, chip enables (E1, E2, E3), address burst
control inputs (ADSP, ADSC, ADV), and write control inputs
(Bx, BW, GW) are synchronous and are controlled by a
positive-edge-triggered clock input (CK). Output enable (G)
and power down control (ZZ) are asynchronous inputs. Burst
cycles can be initiated with either ADSP or ADSC inputs. In
Burst mode, subsequent burst addresses are generated
internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or
interleave order with the Linear Burst Order (LBO) input. The
Burst function need not be used. New addresses can be loaded
on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode
pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS816018/32/36DGT operates on a 3.3 V or 2.5 V power
supply. All input are 3.3 V and 2.5 V compatible. Separate
output power (V_DDQ) pins are used to decouple output noise
from the internal circuits and are 3.3 V and 2.5 V compatible.
Parameter Synopsis
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
t_KQ
tCycle
Curr (x18)
Curr (x32/x36)
t_KQ
tCycle
Curr (x18)
Curr (x32/x36)
-400 -375 -333 -250 -200 -150 Unit
2.5 2.5 2.5 2.5 3.0 3.8 ns
2.5 2.66 3.3 4.0 5.0 6.7 ns
370 350 310 250 210 185 mA
430 410 365 290 240 200 mA
4.0 4.2 4.5 5.5 6.5 7.5 ns
4.0 4.2 4.5 5.5 6.5 7.5 ns
275 265 255 220 205 190 mA
315 300 285 250 225 205 mA
Rev: 1.03a 9/2013
1/24
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology