SES5VSC70-6U Datasheet, PDF (4/6 Pages) GOOD-ARK Electronics – Low Capacitance ESD Protector Array

Low Capacitance ESD Protector Array
SES5VSC70-6U
SES Series
ROHS
Application Information
Device Connection Options for Protection of Four High-Speed Data Lines
This device is designed to protect data lines by clamping them to a fixed reference. When the voltage on the protected line
exceeds the reference voltage the steering diodes are forward biased, conducting the transient current away from the
sensitive circuitry. Data lines are connected at pins 1, 3, 4 and 6. Pin 2 should be connected directly to a ground plane. The
path length is kept as short as possible to minimize parasitic inductance. The positive reference is connected at pin 5. The
options for connecting the positive reference are as follows:
1. To protect data lines and the power line, connect pin 5 directly to the positive supply rail (V_CC). In this configuration the data
lines are referenced to the supply voltage. The internal TVS diode prevents over-voltage on the supply rail.
2. In applications where the supply rail does not exit the system, the internal TVS may be used as the reference. In this case,
pin 5 is not connected. The steering diodes will begin to conduct when the voltage on the protected line exceeds the working
voltage of the TVS (plus one diode drop).
3. In applications where complete supply isolation is desired, the internal TVS is again used as the reference and V_CC is
connected to one of the I/O inputs. An example of this configuration is the protection of a SIM port. The Clock, Reset, I/O, and
VCC lines are connected at pins 1, 3, 4, and 6. Pin 2 is connected to ground and pin 5 is not connected.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of
100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is
placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore,
these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free
compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
ESD Protector
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