GS3140 Datasheet, PDF (38/40 Pages) Semtech Corporation – Multi-Rate Adaptive 3G SDI Equalizer

7.2 Packaging Data
Table 7-1: Packaging Data
Parameter
Value
Package Type
4mm x 4mm 16-pin QFN–COL
Package Drawing Reference
JEDEC MO-220
Moisture Sensitivity Level
3
Junction to Air Thermal Resistance, θ_j-a (at zero airflow)
Junction to Board Thermal Resistance, θ_j-b
Junction to Case Thermal Resistance, θ_j-c
63.0°C/W
37.0°C/W
44.5°C/W
Psi, Ψ − Junction-to-Top Characterization Parameter
2.5°C/W
Pb-free and RoHS compliant
Yes
7.3 Recommended PCB Footprint
0.325
3.75 2.90
4.60
0.85
0.65
0.40
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS
2. SQUARE PACKAGE - DIMENSIONS APPLY IN BOTH “X” AND “Y” DIRECTIONS
Figure 7-2: Recommended PCB Footprint
GS3140
Final Data Sheet
PDS-060939
Rev.1
May 2015
www.semtech.com
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Semtech
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