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8052P Datasheet, PDF (2/9 Pages) Gennum Corporation – Low ESD Clamping Voltage
Absolute Maximum Ratings
Rating
Peak Pulse Current (tp = 8/20µs)
ESD per IEC 61000-4-2 (Contact)(1)
ESD per IEC 61000-4-2 (Air)(1)
ESD per ISO-10605 (Contact)(2)
ESD per ISO-10605 (Air)(2)
Operating Temperature
Storage Temperature
Symbol
IPP
VESD
VESD
TJ
TSTG
Value
6
±25
±30
±25
±30
-40 to +125
-55 to +150
Units
A
kV
kV
OC
OC
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
ESD Clamping Voltage(3)
ESD Clamping Voltage(3)
Dynamic Resistance(3), (4)
Total Channel Capacitance
Differential (SDD21) Cut-Off
Frequency
Common Mode (SCC21)
Attenuation
Channel Resistance
Symbol Conditions
-40OC to 125OC
VRWM
Pin 1 or Pin 2 to Pin 3
VBR
It = 1mA,
Pin 1 or 2 to Pin 3
-40OC to 125OC
IR
VRWM = 5V
T = 25OC
VC
IPP = 1A, tp = 8/20µs,
Pin 1 or 2 to Pin 3
VC
IPP = 6A, tp = 8/20µs,
Pin 1 or 2 to Pin 3
VC
IPP = 4A, tp = 0.2/100ns (TLP)
Pin 1 or 2 to Pin 3
VC
IPP = 16A, tp = 0.2/100ns (TLP)
Pin 1 or 2 to Pin 3
tp = 0.2/100ns (TLP)
RDYN
Pin 1 or 2 to Pin 3
CIN
VR = 0V, f = 1MHz
Pin 1 or 2 to Pin 3
T = 25OC
f3dB
50 Ohm Source and Load Termination
f = 75MHz
fATT
f = 500MHz
f = 1GHZ - 2.5GHz
RCH
Input to Output
Min. Typ. Max. Units
5
V
6.5
9
11
V
0.005 0.100
μA
12
V
17
V
11
V
17
V
0.50
Ohms
0.95
1.2
pF
3
GHz
3
dB
10
dB
20
dB
1.3
1.8 Ohms
Notes:
(1): ESD Gun return path to Ground Reference Plane (GRP)
(2): ESD Gun return path to Horizontal Coupling Plane (HCP); Test conditions: a)150pF/330pF, 330W b) 150pF/330pF, 2kW
(3): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
(4): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
EClamp8052P
Final Datasheet
May 7, 2015
Rev 4.0
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