GB50SLT06-CAL Datasheet, PDF (3/4 Pages) GeneSiC Semiconductor, Inc. – Silicon Carbide Power Schottky Diode Chip

Chip Dimensions:
Die Datasheet*
GB50SLT06-CAL
DIE
A
[mm]
B
[mm]
4.5
4.5
METAL
C
[mm]
D
[mm]
4.24
4.24
WIRE
E
[mm]
4.2
BONDABLE
F
[mm]
4.2
Date
2014/09/08
Revision History
Revision
Comments
1
Initial Release
Supersedes
Published by
GeneSiC Semiconductor, Inc.
43670 Trade Center Place Suite 155
Dulles, VA 20166
GeneSiC Semiconductor, Inc. reserves right to make changes to the product specifications and data in this document without notice.
GeneSiC disclaims all and any warranty and liability arising out of use or application of any product. No license, express or implied to any
intellectual property rights is granted by this document.
Unless otherwise expressly indicated, GeneSiC products are not designed, tested or authorized for use in life-saving, medical, aircraft
navigation, communication, air traffic control and weapons systems, nor in applications where their failure may result in death, personal
injury and/or property damage.
Sep 2014
http://www.genesicsemi.com/index.php/hit-sic/baredie
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