APXS002A0X-SRZ Datasheet, PDF (17/24 Pages) General Semiconductor – 2A PicoTLynxTM: Non-Isolated DC-DC Power Modules 3Vdc –14Vdc input; 0.6Vdc to 5.5Vdc output; 2A Output Current

GE
2A PicoTLynx^TM: Non-Isolated DC-DC Power Modules
3Vdc –14Vdc input; 0.6Vdc to 5.5Vdc output; 2A Output Current
Data Sheet
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will result
in an increase in reliability. The thermal data presented here is
based on physical measurements taken in a wind tunnel. The
test set-up is shown in Figure 59. The preferred airflow direction
for the module is in Figure 60.
Wind Tunnel
PWBs
25.4_
(1.0)
Power Module
Figure 60. Preferred airflow direction and location of
hot-spot of the module (Tref).
76.2_
(3.0)
x
12.7_
(0.50)
Air
flow
Probe Location
for measuring
airflow and
ambient
temperature
Figure 59. Thermal Test Setup.
The thermal reference points, Tref used in the specifications are
also shown in Figure 13. For reliable operation the temperatures
at these points should not exceed 140^oC. The output power of
the module should not exceed the rated power of the module
(Vo,set x Io,max).
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
February 26, 2013
©2013 General Electric Company. All rights reserved.
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