MB39A132QN-G-ERE1 Datasheet, PDF (6/56 Pages) Fujitsu Component Limited. – ASSP For Power Management Applications (Rechargeable Battery) Synchronous Rectification DC/DC Converter IC for Charging Li-ion Battery

MB39A132
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Power supply voltage
CB pin input voltage
CTL1, CTL2 pin
input voltage
Input voltage
ACIN input voltage
ACOK pin
output voltage
Output current
Power dissipation
Storage temperature
Symbol
Condition
VVCC
VVIN
VCB
VCC pin
VIN pin
CB pin
VCTL CTL1, CTL2 pins
VINC
VADJ
VINE
VACIN
-INC1, +INC1 pins
-INC2, +INC2, BATT pins
ADJ1, ADJ2, ADJ3, CELLS pins
-INE1, -INE3 pins
ACIN pin
VACOK ACOK pin
IOUT OUT1, OUT2 pins
Ta ≤ + 25 °C
PD
Ta = + 85 °C
TSTG
⎯
Rating
Unit
Min
Max
− 0.3
+ 27
V
− 0.3
+ 27
V
− 0.3
+ 32
V
− 0.3
+ 27
V
− 0.3
+ 27
V
− 0.3
+ 20
V
− 0.3 VVREF + 0.3 V
− 0.3 VVREF + 0.3 V
− 0.3
VVIN
V
− 0.3
+ 27
V
− 60
⎯
⎯
⎯
⎯
− 55
+ 60
4400*^1,*^2,*³
1900*^1,*^2,*⁴
1760*^1,*^2,*³
760*^1,*^2,*⁴
+ 125
mA
mW
mW
mW
mW
°C
*1 : See the diagram of “■ TYPICAL CHARACTERISTICS • Power Dissipation vs. Operating Ambient Tem-
perature”, for the package power dissipation of Ta from + 25 °C to + 85 °C.
*2 : When the IC is mounted on a 10x10 cm two-layer square epoxy board.
*3 : IC is mounted on a two-layer epoxy board, which has thermal vias, and the IC's thermal pad is connected
to the epoxy board.
*4 : IC is mounted on a two-layer epoxy board, which has no thermal vias, and the IC's thermal pad is connected
to the epoxy board.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
6
DS04–27265–3E