MB3836 Datasheet, PDF (25/28 Pages) Fujitsu Component Limited. – Li-Ion Battery Protection IC

MB3836
s PARTS LIST
COMPONENT
ITEM
SPECIFICATION
M1, M2
FET
VDS = −30 V
ZD1
Diode
C1
C2
C5
C6
C7
C9, C10, C11
C12
C13, C14, C15
Ceramics Condenser
Ceramics Condenser
Ceramics Condenser
Ceramics Condenser
Ceramics Condenser
Ceramics Condenser
Ceramics Condenser
Ceramics Condenser
R1, R2, R3
R4, R5, R9
R6
R7
R8
R13, R14
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
200 mW, 18 V ± 7%
0.1 µF
1.5 µF
0.15 µF
560 pF
0.01 µF
4700 pF
0.22 µF
0.1 µF
25 V (10%)
16 V (10%)
16 V (10%)
50 V (5%)
25 V (10%)
25 V (10%)
25 V (10%)
25 V (10%)
1 kΩ
1 MΩ
10 Ω
100 Ω
100 kΩ
10 kΩ
1/16 W, 5%
1/16 W, 5%
1/16 W, 5%
1/16 W, 5%
1/16 W, 5%
1/16 W, 5%
Note: VISHAY SILICONIX : VISHAY Intertechnology, Inc.
TOSHIBA : TOSHIBA CORPORATION
VENDOR
VISHAY
SILICONIX
TOSHIBA


PARTS No.
Si4425DY
02CZ18-Y


s USAGE PRECAUTION
•Printed circuit board ground lines should be set up with consideration for common impedance.
•Take appropriate static electricity measures.
• Containers for semiconductor materials should have anti-static protection or be made of conductive material.
• After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
• Work platforms, tools, and instruments should be properly grounded.
• Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ between body and ground.
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