MB85RC256VPNF-G Datasheet, PDF (23/36 Pages) Fujitsu Component Limited. – 256 K (32 K × 8) Bit I2C

MB85RC256V
(Continued)
8-pin plastic SOP
(FPT-8P-M08)
Lead pitch
Package width ×
package length
Lead shape
Lead bend
direction
Sealing method
Mounting height
1.27 mm
5.30 mm × 5.24 mm
Gullwing
Normal bend
Plastic mold
2.10 mm Max
8-pin plastic SOP
(FPT-8P-M08)
#5.24±0.10
(.206±.004)
8
5
BTM E-MARK
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) # : These dimensions do not include resin protrusion.
"A"
INDEX
1
1.27(.050)
#5.30±0.10
(.209±.004)
7.80
+0.45
–0.10
.307
+.018
–.004
4
0.43±0.05
(.017±.002)
0.20±0.05
(.008±.002)
Details of "A" part
2.10(.083)
MAX
(Mounting height)
0.10
+0.15
–0.05
.004
+.006
–.002
(Stand off)
0~8°
0.75
+0.10
–0.20
.030
+.004
–.008
C _{2008-2010 FUJITSU SEMICONDUCTOR LIMITED F08016S-c-1-2}
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
DS501-00017-3v0-E
23