YA982C6R Datasheet, PDF (7/12 Pages) Fuji Electric – SILICON DIODE

INSTALLATION
ɾSoldering involves temperatures which exceed the device storage temperature rating. To avoid
device damage and to ensure reliability, observe the following guidelines from the quality
assurance standard.
Table 1: Solder temperature and duration
Method
Solder
temperature
Duration
Flow
260ʶ5ˆ
10ʶ1sec
Soldering iron
350ʶ10ˆ
3.5ʶ0.5sec
ɾThe immersion depth of the lead should basically be up to the lead stopper and the distance
should be a maximum of 1.5mm from the device.
ɾWhen flow-soldering, be careful to avoid immersing the package in the solder bath.
ɾRefer to the following torque reference When mounting the device on a heat sink. Excess
torque applied to the mounting screw causes damage to the device and weak torque will
increase the thermal resistance, both of which conditions may destroy the device.
Table 2:Recommended tightening torque
Package style Screw Recommended tightening torque
TO-220
M3
0.3ʙ0.5Nɾm
ɾThe heat sink should have a flatness within ʶ30Жm and roughness within 10Жm. Also, keep
the tightening torque within the limits of this specification.
ɾImproper handling may cause isolation breakdown leading to a critical accident.
ɾWe recommend the use of thermal compound to optimize the efficiency of heat radiation. It is
important to evenly apply the compound and to eliminate any air voids.
STORAGE
ɾThe Diodes must be stored at a standard temperature of 5 to 35ˆ and relative humidity of 45
to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only
deionized water or boiled water, since the chlorine in tap water may corrode the leads.
ɾThe Diodes should not be subjected to rapid changes in temperature to avoid condensation on
the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is
steady.
ɾThe Diodes should not be stored on top of each other, since this may cause excessive external
force on the case.
ɾThe Diodes should not be stored with the lead terminals remaining unprocessed. Rust may
cause presoldered connections to go fail during later processing.
ɾThe Diodes should be stored in antistatic containers or shipping bags.
Fuji Electric Device Technology Co.,Ltd.


MS5D3304

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^H04-004-03a