YA846C04B Datasheet, PDF (7/12 Pages) Fuji Electric – Schottky Barrier Diode

Installation
・Soldering involves temperatures which exceed the device storage temperature rating. To avoid device
damage and to ensure reliability, observe the following guidelines from the quality assurance standard.
Table 1: Solder temperature and duration
Method
Flow
Soldering iron
Solder
temperature
260±5℃
350±10℃
Duration
10±1second
3.0±0.5second
・The immersion depth of the lead should basically be up to the lead stopper and the distance should
be a maximum of 1.5mm from the device.
・When flow-soldering, be careful to avoid immersing the package in the solder bath.
・Refer to the following torque reference When mounting the device on a heat sink. Excess torque
applied to the mounting screw causes damage to the device and weak torque will increase the
thermal resistance, both of which conditions may destroy the device.
Table 2:Recommended tightening torque
Package style Screw Recommended tightening torque
TO-220
M3 0.3～0.5N・m
・The heat sink should have a flatness within ±30μm and roughness within 10 μm. Also, keep the
tightening torque within the limits of this specification.
・Improper handling may cause isolation breakdown leading to a critical accident.
・We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is
important to evenly apply the compound and to eliminate any air voids.
Storage
・The Diodes must be stored at a standard temperature of 5 to 35℃ and relative humidity of 45 to
75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized
water or boiled water, since the chlorine in tap water may corrode the leads.
・The Diodes should not be subjected to rapid changes in temperature to avoid condensation on the
surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady.
・The Diodes should not be stored on top of each other, since this may cause excessive external force
on the case.
・The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may cause
presoldered connections to go fail during later processing.
・The Diodes should be stored in antistatic containers or shipping bags.
Fuji Electric Co.,Ltd.
MS5D1917 7/12
H04-004-03