FT260 Datasheet, PDF (50/58 Pages) Future Technology Devices International Ltd. – Future Technology Devices International Ltd.

FT260 HID-CLASS USB TO UART/I2C BRIDGE IC
Version 1.0
D oc ument N o.: FT _001272 C learance N o.: FT D I#484
10 Package Parameters
The FT260 is available in a WQFN-28 package. The solder reflow profile for WQFN-28 is described in
Section 10.3.
10.1 WQFN-28 Package Mechanical Dimensions
Figure 10.1 WQFN-28 Package Dimensions
The FT260 is supplied in a RoHS compliant leadless WQFN-28 package. The package is lead (Pb) free,
and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.5mm pitch. The above
mechanical drawing shows the WQFN-28 package. All dimensions are in millimetres.
The centre pad on the base of the FT260H is internally connected to GND and the PCB should not have
signal tracking on the top layer under this area. Connect to GND.
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