33793 Datasheet, PDF (5/27 Pages) Freescale Semiconductor, Inc – Distributed System Interface (DSI) Sensor Interface

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
I/O Pin Voltage
I/O Pin Current
BUSIN, BUSOUT, BUSRTN, and H_CAP Voltage
BUSIN, BUSOUT, BUSRTN, and H_CAP Current (Continuous)
ESD Protection ⁽¹⁾
Human Body Model
Machine Model
THERMAL RATINGS
V_IO
-0.3 to V_REGOUT + 0.5
V
I_IO
5.0
mA
V_IN
-0.3 to 40
V
I_IN
250
mA
V
V_ESD1
±2000
V_ESD2
±200
Storage Temperature
T_STG
-55 to 150
°C
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow ⁽²⁾, ⁽³⁾
T_J
-40 to 150
°C
T_PPRT
Note 3.
°C
Thermal Resistance Junction to Case
R_θJC
150
°C/W
Notes
1. ESD1 performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω), ESD2 performed in accordance with the
Machine Model (C_ZAP = 200 pF, R_ZAP = 0 Ω).
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33793
5