33730_10 Datasheet, PDF (5/26 Pages) Freescale Semiconductor, Inc – Switch Mode Power Supply with Multiple Linear Regulators

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
Supply Voltage (VBAT)
Keep-Alive Supply Voltage (KA_VBAT)
Control Inputs (VIGN, P1, P2, P3), PFD Output
V_BAT
- 0.3 to +40
V
KA_V_BAT
- 18 to +40
V
- 18 to +40
V
Bootstrap Voltage (BOOT, SR) referenced to ground
Bootstrap Voltage (BOOT, SR) referenced to SW
Charge Pump Output Voltage (CP)
Switch Node Voltage SW
Sensor Supplies (VREF1, VREF2)
Sensor Supplies (VREF1, VREF2) Maximum Slew Rate
Regulator Voltages (V_DDH,V_DD3, V_{DD3_B}, V_DDL,V_{DDL_B}, V_KAM)
Open Drain Outputs (RSTH, RSTL, RST3, RSTKAM, IGN_ON)
Regon Input
Analog Inputs (VCOMP, INV, FREQ, HRT)
ESD Voltage⁽¹⁾
Human Body Model - HBM (all pins except BOOT, VDDL, RSTL)
Human Body Model - HBM (Pins BOOT, VDDL, RSTL)
Machine Model - MM (all pins)
Charge Device Model - CDM (all pins)
V_BOOT
V_BOOT - V_SW
V_CP
V_SW
V_REF
V_REFMAXSR
V_REG
V_DD
V_REGON
V_IN
V_ESD
- 0.3 to +50
- 0.3 to +12
- 0.3 to +12
- 2.0 to +40
- 1.0 to +26.5
2.0
- 0.3 to +7.0
- 0.3 to +7.0
-0.3 to +7.0
- 0.3 to + 3.0
± 2000
± 1500
± 200
±750
V
V
V
V
V
V/µs
V
V
V
V
V
Operational Package Temperature (Ambient Temperature)
Storage Temperature
Peak Package Reflow Temperature During Reflow^{(2), (3)}
T_{A_MAX}
- 40 to + 125
°C
T_STO
- 65 to + 150
°C
T_PPRT
Note 3
°C
Maximum Junction Temperature
Thermal Resistance, Junction to Ambient⁽⁴⁾
Thermal Resistance, Junction to Case⁽⁵⁾
T_{J_MAX}
150
°C
R_θJ-A
41
°C/W
R_θJ-C
1.2
°C/W
Notes
1. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), the Machine Model (MM) (AEC-Q100-003),
R_ZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (AEC-Q100-011).
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
4. Thermal resistance measured in accordance with EIA/JESD51-2.
5. Theoretical thermal resistance from the die junction to the exposed pad.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33730
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