KMC7448HX1700LD Datasheet, PDF (47/60 Pages) Freescale Semiconductor, Inc – RISC Microprocessor Hardware Specifications

Heat Sink
Heat Sink
Clip
Thermal
Interface Material
HCTE LGA Package
System Design Information
Printed-Circuit Board
Figure 23. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
There are several commercially-available heat sinks for the MPC7448 provided by the following vendors:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
408-567-8082
Calgreg Thermal Solutions
60 Alhambra Road, Suite 1
Warwick, RI 02886
Internet: www.calgregthermalsolutions.com
888-732-6100
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
818-842-7277
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.tycoelectronics.com
800-522-6752
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
603-635-2800
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Freescale Semiconductor
47