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MCF523X_06 Datasheet, PDF (45/46 Pages) Freescale Semiconductor, Inc – Integrated Microprocessor Hardware Specification | |||
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Rev. No.
1.5
1.6
1.7
1.8
2
Document Revision History
Table 26. Document Revision History (continued)
Substantive Change(s)
⢠Removed Overview, Features, Modes of Operation, and Address Multiplexing sections. This
information can be found in the MCF5235 Reference Manual.
⢠Removed list of documentation table in Section 8, âDocumentation.â. An up-to-date list is
always available on our web site.
⢠Table 9: Changed core supply voltage (VDD) from 1.35-1.65 to 1.4-1.6.
⢠Table 10: Changed max fICO frequency from â75 MHzâ to â150 MHzâ.
⢠Added Section 5.2.1, âSupply Voltage Sequencing and Separation Cautions.â
⢠Updated 196MAPBGA package dimensions, Figure 3.
⢠Table 2: Changed SD_CKE pin location from 139 to âââ for the 160QFP device. Changed
QSPI_CS1 pin location from âââ to 139 for the 160QFP device.
⢠Figure 8: Changed pin 139 label from âSD_CKE/QSPI_CS1â to âQSPI_CS1/SD_CKEâ.
⢠Removed second sentence from Section 7.10.1, âMII Receive Signal Timing (ERXD[3:0],
ERXDV, ERXER, and ERXCLK),â and Section 7.10.2, âMII Transmit Signal Timing (ETXD[3:0],
ETXEN, ETXER, ETXCLK),â regarding no minimum frequency requirement for TXCLK.
⢠Removed third and fourth paragraphs from Section 7.10.2, âMII Transmit Signal Timing
(ETXD[3:0], ETXEN, ETXER, ETXCLK),â as this feature is not supported on this device.
MCF523x Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
45
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