MCF523X_06 Datasheet, PDF (25/46 Pages) Freescale Semiconductor, Inc – Integrated Microprocessor Hardware Specification

Preliminary Electrical Characteristics
3 _{Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board}
temperature is measured on the top surface of the board near the package.
4 _{Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883}
Method 1012.1).
5 _{Thermal characterization parameter indicating the temperature difference between package top and the junction}
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
6 _{At 100MHz.}
The average chip-junction temperature (T_J) in °C can be obtained from:
T_J = T_A + (P_D × Θ_JMA) (1)
Where:
T_A= Ambient Temperature, °C
Θ_JMA= Package Thermal Resistance, Junction-to-Ambient, °C/W
P_D= P_INT + P_I/O
P_INT= I_DD × V_DD, Watts - Chip Internal Power
P_I/O= Power Dissipation on Input and Output Pins — User Determined
For most applications P_I/O < P_INT and can be ignored. An approximate relationship between P_D
and T_J (if P_I/O is neglected) is:
P_D = K ÷ (T_J + 273°C) (2)
Solving equations 1 and 2 for K gives:
K = P_D × (T_A + 273 °C) + Θ_JMA × P_D ² (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P_D (at equilibrium) for a known T_A. Using this value of K, the values of P_D and
T_J can be obtained by solving equations (1) and (2) iteratively for any value of T_A.
7.3 DC Electrical Specifications
Table 9. DC Electrical Specifications¹
Characteristic
Core Supply Voltage
Pad Supply Voltage
Input High Voltage
Input Low Voltage
Input Hysteresis
Input Leakage Current
V_in = V_DD or V_SS, Input-only pins
High Impedance (Off-State) Leakage Current
V_in = V_DD or V_SS, All input/output and output pins
Symbol
Min
V_DD
OV_DD
V_IH
V_IL
V_HYS
I_in
1.4
3
0.7 × OV_DD
V_SS – 0.3
0.06 × OV_DD
–1.0
I_OZ
–1.0
Typical
—
—
—
—
—
—
—
Max
Unit
1.6
V
3.6
V
3.65
V
0.35 × OV_DD V
—
mV
1.0
µA
1.0
µA
MCF523x Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
25