MPXV7002_08 Datasheet, PDF (4/10 Pages) Freescale Semiconductor, Inc – Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
The Pressure (P1) side may be identified by using the
table below:
Part Number
MPXV7002GC6U/GC6T1
MPXV7002GP
MPXV7002DP
Case Type
482A-01
1369-01
1351-01
Pressure (P1)
Side Identifier
Vertical Port Attached
Side with Port Attached
Side with Part Marking
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.660
16.76
0.100 TYP 8X
2.54
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm SCALE 2:1
Figure 5. Small Outline Package Footprint
MPXV7002
4
Sensors
Freescale Semiconductor