33790 Datasheet, PDF (4/12 Pages) Freescale Semiconductor, Inc – Two-Channel Distributed System Interface (DSI) Physical Interface Device

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Continuous
Load Dump - t < 300 ms
Maximum Voltage on Input / Output Pins
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow ⁽²⁾, ⁽³⁾
Continuous Current per Pin
Thermal Resistance Junction to Ambient
Thermal Shutdown
ESD Voltage (All Pins) ⁽⁴⁾
Human Body Model
Machine Model
V_SUP
V_{SUP (t)}
V_DD
DSIxS, DSIxF ⁽¹⁾
DSIxO ⁽¹⁾
T_STG
T_A
T_J
T_PPRT
V_DD
DSIxR
V_SUP
R_θJA
T_SD
- 0.5 to 25
40
- 0.3 to 5.5
-0.3 to V_DD+0.3
- 0.3 to V_SUP + 0.3
- 55 to 150
-40 to 85
- 40 to 150
Note 3
0 to 10
- 2.5 to 5.0
500
45
155 to 190
V_ESD1
V_ESD2
± 2000
± 200
V
V
°C
°C
°C
°C
mA
°C / W
°C
V
Notes
1. R = 0 Ω.
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
4. ESD1 performed in accordance with the Human Body Model (C_ZAP=100pF, R_ZAP=1500 Ω), ESD2 performed in accordance with the
Machine Model (C_ZAP = 200 pF, R_ZAP = 0 Ω).
33790
4
Analog Integrated Circuit Device Data
Freescale Semiconductor