33790 Datasheet, PDF (11/12 Pages) Freescale Semiconductor, Inc – Two-Channel Distributed System Interface (DSI) Physical Interface Device

REVISION DATE
7.0
5/2006
8.0
11/2006
9.0
11/2006
10.0
12/2006
REVISION HISTORY
REVISION HISTORY
DESCRIPTION OF CHANGES
• Implemented Revision History page
• Converted to Freescale format
• Updated data sheet format
• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Ratings on page 4. Added note with instructions to obtain this information from
www.freescale.com.
• Minor correction changes to Figure 1 and ordering information
• Restated note Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC
standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels
(MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter
the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. on
page 4
Analog Integrated Circuit Device Data
Freescale Semiconductor
33790
11