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K40P144M100SF2_1109 Datasheet, PDF (33/78 Pages) Freescale Semiconductor, Inc – K40 Sub-Family Data Sheet
6.4.1.2
Peripheral operating requirements and behaviors
Flash timing specifications — commands
Table 21. Flash command timing specifications
Symbol
trd1blk256k
Description
Read 1s Block execution time
• 256 KB program/data flash
Min.
—
Typ.
—
Max.
1.7
Unit
Notes
ms
trd1sec2k Read 1s Section execution time (flash sector)
—
—
60
μs
1
tpgmchk Program Check execution time
—
—
45
μs
1
trdrsrc Read Resource execution time
—
—
30
μs
1
tpgm4 Program Longword execution time
—
65
145
μs
Erase Flash Block execution time
2
tersblk256k
• 256 KB program/data flash
—
435
3700
ms
tersscr Erase Flash Sector execution time
—
14
114
ms
2
Program Section execution time
tpgmsec512
tpgmsec1k
tpgmsec2k
• 512 B flash
• 1 KB flash
• 2 KB flash
—
2.4
—
ms
—
4.7
—
ms
—
9.3
—
ms
trd1all Read 1s All Blocks execution time
—
—
1.8
ms
trdonce Read Once execution time
—
—
25
μs
1
tpgmonce Program Once execution time
—
65
—
μs
tersall Erase All Blocks execution time
—
870
7400
ms
2
tvfykey Verify Backdoor Access Key execution time
—
—
30
μs
1
tswapx01
tswapx02
tswapx04
tswapx08
Swap Control execution time
• control code 0x01
• control code 0x02
• control code 0x04
• control code 0x08
—
200
—
μs
—
70
150
μs
—
70
150
μs
—
—
30
μs
Program Partition for EEPROM execution time
tpgmpart256k
• 256 KB FlexNVM
—
450
—
ms
Set FlexRAM Function execution time:
tsetramff
tsetram32k
tsetram256k
• Control Code 0xFF
• 32 KB EEPROM backup
• 256 KB EEPROM backup
—
70
—
μs
—
0.8
1.2
ms
—
4.5
5.5
ms
Byte-write to FlexRAM for EEPROM operation
teewr8bers Byte-write to erased FlexRAM location execution
—
175
260
μs
3
time
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Freescale Semiconductor, Inc.
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