80310_12 Datasheet, PDF (28/31 Pages) Freescale Semiconductor, Inc – Alternator Regulator with LIN

PACKAGING
DIE CHARACTERISTICS
DIE CHARACTERISTICS
The die is designed to be fitted into a customer designed package, however as so many wiring configurations exist not all
may be possible from the same die design. Due to thermal considerations, soldering is the preferred die attach method, but under
some circumstances, conductive epoxy may be acceptable.
Table 16. Physical Die Characteristics.
Mechanical data
Length
Width
Units
Main Bonding Pad Size (200 μm wire)
Die Size (Length x Width)
Die Thickness
Die Back Metal Composition
Die Back Metal Thickness, Typical
Die Top Metal Thickness, Typical
Die Top Metal Composition
0.66
0.5
mm
6.08
5.05
mm
0.36
N/A
mm
Ti/Ni/V/Ag
N/A
N/A
1.45
N/A
μm
2.0
N/A
μm
99.5 Al
0.5 Cu
%
80310
28
Analog Integrated Circuit Device Data
Freescale Semiconductor