K60P144M150SF3_1210 Datasheet, PDF (23/88 Pages) Freescale Semiconductor, Inc – K60 Sub-Family

5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
–40
–40
Max.
125
105
General
Unit
°C
°C
5.4.2 Thermal attributes
Board type Symbol
Single-layer
(1s)
R_θJA
Four-layer
(2s2p)
R_θJA
Single-layer
(1s)
R_θJMA
Four-layer
(2s2p)
R_θJMA
—
R_θJB
—
R_θJC
Description 144 LQFP
Thermal
45
resistance,
junction to
ambient (natural
convection)
Thermal
36
resistance,
junction to
ambient (natural
convection)
Thermal
36
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
30
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
24
resistance,
junction to
board
Thermal
9
resistance,
junction to case
144
MAPBGA
50
30
41
27
17
10
Table continues on the next page...
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
K60 Sub-Family Data Sheet, Rev. 4, 10/2012.
Freescale Semiconductor, Inc.
23