MCF5275 Datasheet, PDF (20/44 Pages) Motorola, Inc – MCF5275 Integrated Microprocessor Family Hardware Specification

Preliminary Electrical Characteristics
5 _{Thermal characterization parameter indicating the temperature difference between package top and the junction}
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
The average chip-junction temperature (T_J) in °C can be obtained from:
T_J = T_A + (P_D × Θ_JMA) (1)
Where:
T_A
Θ_JMA
P_D
P_INT
P_I/O
= Ambient Temperature, °C
= Package Thermal Resistance, Junction-to-Ambient, °C/W
= P_INT + P_I/O
= I_DD × V_DD, Watts - Chip Internal Power
= Power Dissipation on Input and Output Pins — User Determined
For most applications P_I/O < P_INT and can be ignored. An approximate relationship between P_D and T_J (if P_I/O is
neglected) is:
P_D = K ÷ (T_J + 273°C) (2)
Solving equations 1 and 2 for K gives:
K = P_D × (T_A + 273 °C) + Θ_JMA × P_D ² (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P_D (at
equilibrium) for a known T_A. Using this value of K, the values of P_D and T_J can be obtained by solving equations (1)
and (2) iteratively for any value of T_A.
8.3
ESD Protection
Table 9. ESD Protection Characteristics^{1, 2}
Characteristics
Symbol
Value
Units
ESD Target for Human Body Model
HBM
2000
V
ESD Target for Machine Model
MM
200
V
HBM Circuit Description
R_series
C
1500
Ω
100
pF
MM Circuit Description
R_series
C
0
Ω
200
pF
Number of pulses per pin (HBM)
positive pulses
negative pulses
—
—
1
—
1
Number of pulses per pin (MM)
positive pulses
negative pulses
—
—
3
—
3
Interval of Pulses
—
1
sec
1 _{All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive}
Grade Integrated Circuits.
2 _{A device is defined as a failure if after exposure to ESD pulses the device no longer meets the}
device specification requirements. Complete DC parametric and functional testing is
performed per applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2
20
Preliminary—Subject to Change Without Notice
Freescale Semiconductor