MCF5275 Datasheet, PDF (19/44 Pages) Motorola, Inc – MCF5275 Integrated Microprocessor Family Hardware Specification

Preliminary Electrical Characteristics
Table 7. Absolute Maximum Ratings^{1, 2} (continued)
Rating
Symbol
Value
Unit
Instantaneous Maximum Current
Single pin limit (applies to all pins) ^{4, 5}
I_D
25
mA
Operating Temperature Range (Packaged)
T_A
– 40 to 85
°C
(T_L - T_H)
Storage Temperature Range
T_stg
– 65 to 150
°C
1 _{Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum Ratings}
are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond those
listed may affect device reliability or cause permanent damage to the device.
2 _{This device contains circuitry protecting against damage due to high static voltage or electrical fields;}
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V_SS or O V_DD).
3 _{Input must be current limited to the value specified. To determine the value of the required}
current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use
the larger of the two values.
4 _{All functional non-supply pins are internally clamped to VSS and O VDD.}
5 _{Power supply must maintain regulation within operating O VDD range during instantaneous and}
operating maximum current conditions. If positive injection current (V_in > O V_DD) is greater than I_DD, the
injection current may flow out of O V_DD and could result in external power supply going out of
regulation. Insure external O V_DD load will shunt current greater than maximum injection current. This
will be the greatest risk when the MCU is not consuming power (ex; no clock).Power supply must
maintain regulation within operating V_DD range during instantaneous and operating maximum current
conditions.
8.2 Thermal Characteristics
Table 8 lists thermal resistance values
Table 8. Thermal characteristics
Characteristic
Symbol 256MBGA 196MBGA Unit
Junction to ambient, natural convection
Four layer board (2s2p)
θ_JMA
26^1,2
32^1,2
°C / W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
θ_JMA
23^1,2
29^1,2
°C / W
Junction to board
θ_JB
15³
20³
°C / W
Junction to case
θ_JC
10⁴
10⁴
°C / W
Junction to top of package
Natural convection
Ψ_jt
2^1,5
2^1,5
°C / W
Maximum operating junction temperature
T_j
105
105
o_C
1 _{θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale}
recommends the use of θ_JmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψ_jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 _{Per JEDEC JESD51-6 with the board horizontal.}
3 _{Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board}
temperature is measured on the top surface of the board near the package.
4 _{Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883}
Method 1012.1).
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
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