MCF548X Datasheet, PDF (2/28 Pages) Freescale Semiconductor, Inc – Microprocessor Electrical Characteristics

Thermal Characteristics
Table 1. Absolute Maximum Ratings
Rating
External (I/O pads) supply voltage (3.3-V power pins)
Internal logic supply voltage
Memory (I/O pads) supply voltage (2.5-V power pins)
PLL supply voltage
Internal logic supply voltage, input voltage level
Storage temperature range
Symbol
EV_DD
IV_DD
SD V_DD
PLL V_DD
V_in
T_stg
Value
–0.3 to +4.0
–0.5 to +2.0
–0.3 to +4.0 SDR Memory
–0.3 to +2.8 DDR Memory
–0.5 to +2.0
–0.5 to +3.6
–55 to +150
2 Thermal Characteristics
Units
V
V
V
V
V
o_C
2.1 Operating Temperatures
Table 2 lists junction and ambient operating temperatures.
Table 2. Operating Temperatures
Characteristic
Symbol
Value
Units
Maximum operating junction temperature
Maximum operating ambient temperature
Minimum operating ambient temperature
T_j
105
o_C
T_Amax
<85¹
o_C
T_Amin
– 40
o_C
NOTES:
1 _{This published maximum operating ambient temperature should be used only as a system design guideline. All}
device operating parameters are guaranteed only when the junction temperature lies within the specified range.
2.2 Thermal Resistance
Table 3 lists thermal resistance values.
Table 3. Thermal Resistance
Characteristic
324 pin TEPBGA — Junction to ambient, natural Four layer board (2s2p)
convection
388 pin TEPBGA — Junction to ambient, natural Four layer board (2s2p)
convection
Symbol
θ_JMA
θ_JMA
Value
22–24^1,2
20–22^1,2
Unit
°C/W
°C/W
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Four layer board (2s2p)
Natural convection
θ_JMA
θ_JB
θ_JC
Ψ_jt
23^1,2
15³
10⁴
2^1,5
°C/W
°C/W
°C/W
°C/W
MCF548x Integrated Microprocessor Electrical Characteristics, Rev. 2.4
2
Freescale Semiconductor