MC9S08LH64 Datasheet, PDF (2/44 Pages) Freescale Semiconductor, Inc – Advanced Information

Contents
1 Devices in the MC9S08LH64 Series . . . . . . . . . . . . . . . . . . . . 3
2 Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 Parameter Classification. . . . . . . . . . . . . . . . . . . . . . . . . 9
3.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . 9
3.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10
3.5 ESD Protection and Latch-Up Immunity . . . . . . . . . . . . 11
3.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.7 Supply Current Characteristics. . . . . . . . . . . . . . . . . . . 23
3.8 External Oscillator (XOSCVLP) Characteristics . . . . . . 25
• ^{3.9 Internal Clock Source (ICS) Characteristics . . . . . . . . . 26}
3.10 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.10.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.10.2 TPM Module Timing. . . . . . . . . . . . . . . . . . . . . .29
3.10.3 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.11 Analog Comparator (ACMP) Electricals . . . . . . . . . . . .33
3.12 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .33
3.13 VREF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.14 LCD Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
3.15 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .41
3.16 EMC Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
3.16.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . . .42
4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
4.1 Device Numbering System . . . . . . . . . . . . . . . . . . . . . .42
4.2 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . .43
4.3 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . .43
Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will
be the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://freescale.com/
The following revision history table summarizes changes contained in this document.
Rev
Date
Description of Changes
1
10/2007
Intial Release of the electrical characteristics in the Reference Manual.
2
7/2008
Initial Release after product redefinition and restructuring of information into a separate Data
Sheet and Reference Manual.
3
1/2009
Refreshed the draft to include the new VREF module and the latest revisions.
4
4/8/2010
Completed RIDD in the Table 9; updated ERREFSTEN in the Table 10; changed all V_DDAD to
V_DDA, V_SSAD to V_SSA; updated the min. of V_REFH;
Added 64-pin LQFP package information for LH36 MCU; Updated V Room Temp in the
Table 20. Updated S2I_DD at V_DD = 2 and Temp at –40 to 25 °C
Added 64-pin LQFP package for LH36.
Updated ADC data in the 3.12/33
Related Documentation
Find the most current versions of all documents at: http://www.freescale.com
Reference Manual
—MC9S08LH64RM
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
© Freescale Semiconductor, Inc., 2009-2010. All rights reserved.
PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE