K10P32M50SF0 Datasheet, PDF (2/57 Pages) Freescale Semiconductor, Inc – K10 Sub-Family

Table of Contents
1 Ordering parts...........................................................................3
5.3.2 General switching specifications...........................20
1.1 Determining valid orderable parts......................................3
5.4 Thermal specifications.......................................................21
2 Part identification......................................................................3
5.4.1 Thermal operating requirements...........................21
2.1 Description.........................................................................3
5.4.2 Thermal attributes.................................................21
2.2 Format...............................................................................3
6 Peripheral operating requirements and behaviors....................22
2.3 Fields.................................................................................3
6.1 Core modules....................................................................22
2.4 Example............................................................................4
6.1.1 JTAG electricals....................................................22
3 Terminology and guidelines......................................................4
6.2 System modules................................................................25
3.1 Definition: Operating requirement......................................4
6.3 Clock modules...................................................................25
3.2 Definition: Operating behavior...........................................5
6.3.1 MCG specifications...............................................25
3.3 Definition: Attribute............................................................5
6.3.2 Oscillator electrical specifications.........................27
3.4 Definition: Rating...............................................................6
6.3.3 32 kHz Oscillator Electrical Characteristics...........29
3.5 Result of exceeding a rating..............................................6
6.4 Memories and memory interfaces.....................................30
3.6 Relationship between ratings and operating
6.4.1 Flash electrical specifications................................30
requirements......................................................................6
6.4.2 EzPort Switching Specifications............................34
3.7 Guidelines for ratings and operating requirements............7
6.5 Security and integrity modules..........................................35
3.8 Definition: Typical value.....................................................7
6.6 Analog...............................................................................35
3.9 Typical value conditions....................................................8
6.6.1 ADC electrical specifications.................................35
4 Ratings......................................................................................9
6.6.2 CMP and 6-bit DAC electrical specifications.........40
4.1 Thermal handling ratings...................................................9
6.7 Timers................................................................................43
4.2 Moisture handling ratings..................................................9
6.8 Communication interfaces.................................................43
4.3 ESD handling ratings.........................................................9
6.8.1 DSPI switching specifications (limited voltage
4.4 Voltage and current operating ratings...............................9
range)....................................................................43
5 General.....................................................................................10
6.8.2 DSPI switching specifications (full voltage range).45
5.1 AC electrical characteristics..............................................10
6.8.3 I2C switching specifications..................................47
5.2 Nonswitching electrical specifications...............................10
6.8.4 UART switching specifications..............................47
5.2.1 Voltage and current operating requirements.........10
6.8.5 I2S/SAI Switching Specifications..........................47
5.2.2 LVD and POR operating requirements.................11
6.9 Human-machine interfaces (HMI)......................................51
5.2.3 Voltage and current operating behaviors..............12
6.9.1 TSI electrical specifications...................................51
5.2.4 Power mode transition operating behaviors..........13
7 Dimensions...............................................................................53
5.2.5 Power consumption operating behaviors..............14
7.1 Obtaining package dimensions.........................................53
5.2.6 EMC radiated emissions operating behaviors.......18
8 Pinout........................................................................................53
5.2.7 Designing with radiated emissions in mind...........19
8.1 K10 Signal Multiplexing and Pin Assignments..................53
5.2.8 Capacitance attributes..........................................19
8.2 K10 Pinouts.......................................................................54
5.3 Switching specifications.....................................................19
9 Revision History........................................................................55
5.3.1 Device clock specifications...................................19
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
2
Freescale Semiconductor, Inc.