K10P121M100SF2V2 Datasheet, PDF (2/70 Pages) Freescale Semiconductor, Inc – K10 Sub-Family

Table of Contents
1 Ordering parts...........................................................................3
5.4.1 Thermal operating requirements...........................20
1.1 Determining valid orderable parts......................................3
5.4.2 Thermal attributes.................................................20
2 Part identification......................................................................3
6 Peripheral operating requirements and behaviors....................21
2.1 Description.........................................................................3
6.1 Core modules....................................................................21
2.2 Format...............................................................................3
6.1.1 Debug trace timing specifications.........................21
2.3 Fields.................................................................................3
6.1.2 JTAG electricals....................................................22
2.4 Example............................................................................4
6.2 System modules................................................................25
3 Terminology and guidelines......................................................4
6.3 Clock modules...................................................................25
3.1 Definition: Operating requirement......................................4
6.3.1 MCG specifications...............................................25
3.2 Definition: Operating behavior...........................................5
6.3.2 Oscillator electrical specifications.........................27
3.3 Definition: Attribute............................................................5
6.3.3 32 kHz Oscillator Electrical Characteristics...........30
3.4 Definition: Rating...............................................................6
6.4 Memories and memory interfaces.....................................30
3.5 Result of exceeding a rating..............................................6
6.4.1 Flash electrical specifications................................30
3.6 Relationship between ratings and operating
6.4.2 EzPort Switching Specifications............................32
requirements......................................................................6
6.4.3 Flexbus Switching Specifications..........................33
3.7 Guidelines for ratings and operating requirements............7
6.5 Security and integrity modules..........................................36
3.8 Definition: Typical value.....................................................7
6.6 Analog...............................................................................36
3.9 Typical value conditions....................................................8
6.6.1 ADC electrical specifications.................................36
4 Ratings......................................................................................9
6.6.2 CMP and 6-bit DAC electrical specifications.........44
4.1 Thermal handling ratings...................................................9
6.6.3 12-bit DAC electrical characteristics.....................47
4.2 Moisture handling ratings..................................................9
6.6.4 Voltage reference electrical specifications............50
4.3 ESD handling ratings.........................................................9
6.7 Timers................................................................................51
4.4 Voltage and current operating ratings...............................9
6.8 Communication interfaces.................................................51
5 General.....................................................................................10
6.8.1 CAN switching specifications................................51
5.1 AC electrical characteristics..............................................10
6.8.2 DSPI switching specifications (limited voltage
5.2 Nonswitching electrical specifications...............................10
range)....................................................................52
5.2.1 Voltage and current operating requirements.........10
6.8.3 DSPI switching specifications (full voltage range).53
5.2.2 LVD and POR operating requirements.................11
6.8.4 I2C switching specifications..................................55
5.2.3 Voltage and current operating behaviors..............12
6.8.5 UART switching specifications..............................55
5.2.4 Power mode transition operating behaviors..........13
6.8.6 SDHC specifications.............................................55
5.2.5 Power consumption operating behaviors..............14
6.8.7 I2S/SAI Switching Specifications..........................56
5.2.6 EMC radiated emissions operating behaviors.......17
6.9 Human-machine interfaces (HMI)......................................62
5.2.7 Designing with radiated emissions in mind...........18
6.9.1 TSI electrical specifications...................................62
5.2.8 Capacitance attributes..........................................18
7 Dimensions...............................................................................63
5.3 Switching specifications.....................................................18
7.1 Obtaining package dimensions.........................................63
5.3.1 Device clock specifications...................................18
8 Pinout........................................................................................63
5.3.2 General switching specifications...........................19
8.1 K10 Signal Multiplexing and Pin Assignments..................64
5.4 Thermal specifications.......................................................20
8.2 K10 Pinouts.......................................................................68
K10 Sub-Family Data Sheet, Rev. 1, 6/2012.
2
Preliminary
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