K10P104M100SF2 Datasheet, PDF (19/60 Pages) Freescale Semiconductor, Inc – K10 Sub-Family Data Sheet

5.3.1
Peripheral operating requirements and behaviors
Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.3.2 Thermal attributes
Board
type
Single-
layer (1s)
Four-layer
(2s2p)
Single-
layer (1s)
Four-layer
(2s2p)
Symbol
R_θJA
R_θJA
R_θJMA
R_θJMA
Description
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
104
100
MAPBGA LQFP
y _TBD
TBD
Unit
°C/W
r _TBD
TBD
°C/W
a _TBD
TBD
°C/W
in^TBD
TBD
°C/W
Notes
1
1
1
1
—
R_θJB
Thermal resistance, junction to board
TBD
TBD
°C/W
—
R_θJC
Thermal resistance, junction to case
TBD
TBD
°C/W
—
Ψ_JT
Thermal characterization parameter, junction to TBD
TBD
°C/W
lim ^{package top outside center (natural convection)}
e ^{6 Peripheral operating requirements and behaviors}
Pr ^{6.1 Core modules}
2
3
4
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
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