IMX28CEC Datasheet, PDF (19/70 Pages) Freescale Semiconductor, Inc – Processors Data Sheet for Consumer Products

3.2 Thermal Characteristics
The thermal resistance characteristics for the device are given in Table 22. These values are measured
under the following conditions:
• Two layer Substrate
• Substrate solder mask thickness: 0.025 mm
• Substrate metal thicknesses: 0.016 mm
• Substrate core thickness: 0.160 mm
• Core via I.D: 0.068 mm, Core via plating 0.016 mm
• Flag: trace style with ground balls under the die connected to the flag
• Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K
• Mold Compound: generic mold compound, k = 0.9 W/m K
Table 22. Thermal Resistance Data
Rating
Junction to ambient¹ natural convection
Junction to ambient¹ natural convection
Single layer board
(1s)
Four layer board (2s2p)
R_θJA
Value
Unit
62
°C/W
R_θJA 36
°C/W
Junction to ambient¹ (@200 ft/min)
Single layer board
(1s)
R_θJMA 53
°C/W
Junction to ambient¹ (@200 ft/min)
Four layer board
(2s2p)
R_θJMA 33
°C/W
Junction to boards²
R_θJB 24
°C/W
Junction to case (top)³
R_θJCtop 15
°C/W
Junction to package top⁴
Natural Convection
Ψ_JT
3
°C/W
1 _{Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-2 and JESD51-6. Thermal test board meets}
JEDEC specification for this package.
2 _{Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification}
for the specified package.
3 _{Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is}
used for the case temperature. Reported value includes the thermal resistance of the interface layer.
4 _{Thermal characterization parameter indicating the temperature difference between the package top and the junction}
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
3.3 I/O DC Parameters
This section includes the DC parameters of the following I/O types:
• DDR I/O: Mobile DDR (LPDDR1), standard 1.8 V DDR2, and low-voltage 1.5 V DDR2
(LVDDR2)
• General purpose I/O (GPIO)
i.MX28 Applications Processors Data Sheet for Consumer Products, Rev. 1
Freescale Semiconductor
19