908E625 Datasheet, PDF(17/48 Page) Freescale Semiconductor, Inc – Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication

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908E625 Datasheet, PDF (17/48 Pages) Freescale Semiconductor, Inc – Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication

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FUNCTIONAL DESCRIPTION

FUNCTIONAL TERMINAL DESCRIPTION

LIN TRANSCEIVER OUTPUT TERMINAL (RXD)

This terminal is the output of LIN transceiver. The terminal

must be connected to the microcontrollerâs Enhanced Serial

Communications Interface (ESCI) module (RXD terminal).

ADC REFERENCE TERMINALS

(VREFL AND VREFH)

VREFL and VREFH are the reference voltage terminals for

the ADC. It is recommended that a high-quality ceramic

decoupling capacitor be placed between these terminals.

Important VREFH is the high reference supply for the

ADC and should be tied to the same potential as VDDA via

separate traces. VREFL is the low reference supply for the

ADC and should be tied to the same potential as VSS via

separate traces.

For details refer to the 68HC908EY16 datasheet.

ADC SUPPLY TERMINALS (VDDA AND VSSA)

VDDA and VSSA are the power supply terminals for the

analog-to-digital converter (ADC). It is recommended that a

high-quality ceramic decoupling capacitor be placed between

these terminals.

Important VDDA is the supply for the ADC and should be

tied to the same potential as EVDD via separate traces.

VSSA is the ground terminal for the ADC and should be tied

to the same potential as EVSS via separate traces.

For details refer to the 68HC908EY16 datasheet.

MCU POWER SUPPLY TERMINALS

(EVDD AND EVSS)

EVDD and EVSS are the power supply and ground

terminals. The MCU operates from a single power supply.

Fast signal transitions on MCU terminals place high, short-

duration current demands on the power supply. To prevent

noise problems, take special care to provide power supply

bypassing at the MCU.

For details refer to the 68HC908EY16 datasheet.

TEST TERMINAL (FLSVPP)

This terminal is for test purposes only. This terminal should

be either left open (not connected) or connected to GND.

EXPOSED PAD TERMINAL

The exposed pad terminal on the bottom side of the

package conducts heat from the chip to the PCB board. For

thermal performance the pad must be soldered to the PCB

board. It is recommended that the pad be connected to the

ground potential.

Analog Integrated Circuit Device Data

Freescale Semiconductor

908E625

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