MC9S08PA16 Datasheet, PDF (16/33 Pages) Freescale Semiconductor, Inc – MC9S08PA16 Series

Thermal specifications
t_clkh
t_TCLK


TCLK
t_clkl
Figure 9. Timer external clock
t_ICPW
FTMCHn
FTMCHn
t_ICPW
Figure 10. Timer input capture pulse
5.3 Thermal specifications
5.3.1 Thermal characteristics
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take P_I/O into account in
power calculations, determine the difference between actual pin voltage and V_SS or V_DD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin
current (heavy loads), the difference between pin voltage and V_SS or V_DD will be very
small.
Table 8. Thermal characteristics
Rating
Operating temperature range T_A
(packaged)
Junction temperature range T_J
44-pin LQFP
θ_JA
32-pin LQFP
θ_JA
20-pin SOIC
θ_JA
20-pin TSSOP
θ_JA
16-pin TSSOP
θ_JA
Symbol
Value
T_L to T_H -40 to 105
-40 to 150
Thermal resistance single-layer board
76
88
82
116
130
Table continues on the next page...
Unit
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
MC9S08PA16 Series Data Sheet, Rev. 1, 10/9/2012.
16
Freescale Semiconductor, Inc.