MCF5271 Datasheet, PDF (14/40 Pages) Freescale Semiconductor, Inc – Integrated Microprocessor Hardware Specification

Mechanicals/Pinouts and Part Numbers
6.2 Package Dimensions—196 MAPBGA
Figure 3 shows MCF5270/71CVMxxx package dimensions.
X
D
Y
Laser mark for pin 1
identification in
this area
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
M
3. Dimension b is measured at the
maximum solder ball diameter,
K
parallel to datum plane Z.
4. Datum Z (seating plane) is defined
by the spherical crowns of the solder
balls.
5. Parallelism measurement shall
exclude any effect of mark on top
surface of package.
E
TOL
14 13 12 11 10 9
13X e
S
654 32 1
S
13X e
3
196X
b
0.15 Z X Y
0.08 Z
View M-M
Millimeters
DIM
Min
Max
A
1.25
1.60
A1 0.27
0.47
A2
1.16 REF
M
b
0.45
0.55
D
15.00 BSC
E
15.00 BSC
Metalized mark for
pin 1 identification
in this area
e
1.00 BSC
S
0.50 BSC
A
B
C
D
5
E
F
A ^A2
G
0.20 Z
H
J
K
A1
Z4
0.10 Z
196X
L
Detail K
M
Rotated 90° Clockwise
N
P
Figure 3. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
14
Freescale Semiconductor