MCIMX31C Datasheet, PDF (11/110 Pages) Freescale Semiconductor, Inc – Multimedia Applications Processors for Industrial and Automotive Products

Electrical Characteristics
Table 6 provides the thermal resistance data for the 19 × 19 mm, 0.8 mm pitch package.
Table 6. Thermal Resistance Data—19 × 19 mm Package
Rating
Board
Symbol
Value Unit Notes
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case (Top)
Junction to Package Top (natural convection)
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
—
—
—
R_θJA
R_θJA
R_θJMA
R_θJMA
R_θJB
R_θJCtop
Ψ_JT
46
°C/W 1, 2, 3
29
°C/W 1, 2, 3
38
°C/W 1, 2, 3
25
°C/W 1, 2, 3
19
°C/W
1, 3
10
°C/W
1, 4
2
°C/W
1, 5
NOTES
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
2. Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6.
Thermal test board meets JEDEC specification for this package.
3. Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board
meets JEDEC specification for the specified package.
4. Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The
cold plate temperature is used for the case temperature. Reported value includes the thermal
resistance of the interface layer.
5. Thermal characterization parameter indicating the temperature difference between the package
top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
MCIMX31C/MCIMX31LC Technical Data, Rev. 4
Freescale Semiconductor
11